
Product
Product
WH-DP50 semiconductor laser marking machine
Basic information
商品名称: WH-DP50 半导体激光打标机
商品编号: WH-DP50 半导体激光打标机
上架时间: 2015-05-21
适用材料: 普通金属及合金(铁、铜、铝、镁、锌等所有金属),稀有金属及合金(金、银、钛),金属氧化物,特殊表面处理(磷化、铝阳极化、电镀表面),ABS料(电器用品外壳,日用品),油墨(透光按键、印刷制品),环氧树
适用行业: 应用于电子元器件、五金制品、工具配件、集成电路(IC)、电工电器、手机通讯、精密器械、眼镜钟表、首饰饰品、汽车配件、塑胶按键、建材、PVC管材、医疗器械等行业。
Product details
Trade name: WH-DP50 semiconductor laser marking machine
Product No.: WH-DP50 semiconductor laser marking machine
On sale time: 2015-05-21
Applicable materials: common metals and alloys (all metal including iron, copper, aluminium, magnesium, zinc, and etc.), rara metals and alloys (gold, silver, titanium), metallic oxides, ABS materials, inks, epoxy resins, and etc.
Application: electronic components, hardware products, tools, integrated circuits (IC), precision machineries, auto parts, building materials, PVC pipes, and etc.
Optical design:
Laser cavity adopts novel design philosophy.
Machine design:
Adopting integrated design, novel light path sealing mode.
Parameters:
Model Model name
|
WH-DP 50/75 |
Max. average power |
50W/75W |
Wavelength |
1064nm |
Beam quality |
<3(25A) |
Pulse Frequency |
≤60KHz |
Marking area |
50mmX50mm/100mmX100mm/175mmX175mm |
Marking Speed |
Linear scan 7000mm/s |
Min. line width |
50um |
Min. character size |
0.3mm |
Repeat Accuracy |
±0.003mm |
M Power Consumption |
<2.0KW |
Marking Graph |
User-defined character , CAD data |
Supported Format |
BMP,JPG,PNG,TIF,PCX,TAG,IOO,GIF,PLT |
Operation Humidity |
45%-75% |
Working Temperature |
10℃-30℃ |
Dimension |
1250mmx1220mmx1350mm |
Weight |
200kg/230kg |
Samples:
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